Thermal conductive composition based on modified epoxy resin exhibits high dielectric properties
In the present work, the properties of the multifunctional heat-resistant composite material based on epoxy resin and modified with tetraethoxysilane filled with boron nitride was described. The influence of boron nitride on the physical, mechanical, thermal, and electrical properties of a sealant was investigated. The dependence of specific electrical resistance, dielectric permittivity, and dielectric loss tangent of the material on tetraethoxysilane (TES) modifier and boron nitride (BN) filler content in concentrations that allow for acceptable rheological properties suitable for use as a f
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